10 ways Factors Affecting Fusion Performance in Fusion PCB F

2018-11-23 17:53Writer: qyadminReading:

       • Fusion Welding Joint

  Based on table demonstrated above, because the area of rectangular fusion welding joint is three times larger than that of circular fusion welding joint, bond generated by rectangular fusion welding joint is obviously larger than that generated by circular fusion welding joint. Nevertheless, resin flow generated by rectangular fusion welding joint is much more than that generated by circular fusion welding joint. When resin flow is too large, partial board side will be possibly higher than board, possibly causing virtual pressure on board side. When it comes to small-size PCB products, because designable fusion points are so limited and circular fusion welding joints features small area, fusion bond will be insufficient. As a result, rectangular fusion welding joint should be picked and fusion positions should be carefully designed. With board moved inward suitably, the defect of over resin flow can be defeated.

  • Fusion Temperature

  When fusion temperature reaches 300°C, fusion expansion area is relatively large with fusion effect badly aroused. When fusion temperature reaches 270°C, fusion expansion area is uneven with crack risk with fusion effect badly aroused. When fusion temperature reaches 285°C, fusion expansion is even with no crack risk, leading to optimal fusion effect. Therefore, it can be concluded that at the same fusion time and layer stackup, 285°C is the best fusion temperature for multi-layer PCB fabrication.

  • Fusion Time

  At equivalent fusion temperature and layer stackup, different fusion time affects fusion expansion area and fusion effect. When fusion time is 12 seconds, fusion expansion area is uneven with crack risk and badly-performed fusion effect. When fusion time is 18 seconds, fusion expansion area is large with bad fusion effect. When fusion time is 15 seconds, fusion expansion is even with no crack risk and optimal fusion effect. Thus, at equivalent fusion temperature and equivalent layer stackup, 15 seconds is an optimal fusion time for multi-layer PCB fabrication. Either too long or too short fusion time will bring forward bad fusion effect.

  • Layer Stackup

  At equivalent fusion temperature and fusion time, different layer stackups determine fusion area and fusion effect. At equivalent fusion time and fusion temperature, fusion expansion area is even with no cracks as prepreg 2116 is applied, leading to optimal fusion effect. At equivalent fusion time and fusion temperature, fusion expansion area is even with cracks as prepreg 7628 is applied. It indicates that at equivalent fusion time and fusion temperature, the thinner prepreg is, the better fusion effect will be generated. Therefore, it can be concluded that layer stackup with 2116 prepreg or below is suitable for fusion technology implementation during multi-layer PCB fabrication.
  In accordance with the discussion in this article, there are many factors affecting fusion effect: fusion welding joint shape, fusion temperature, fusion time and layer stackup. Rectangular fusion welding joint brings forward better fusion effect than circular fusion welding joint. At equivalent layer stackup and fusion time, the higher fusion temeprature is, fusion expansion area will be. Too low fusion temperature will lead fusion expansion area to be uneven with crack risks. The longer fusion time is, the larger fusion expansion area will be. When fusion time exceeds 15 seconds, fusion expansion area will be enlarged with bad fusion effect generated. The thinner prepreg structure is, the more even fusion expansion will be. Thus, 2116 or below prepreg is the most suitable for fusion.

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