part 3 : let’s define some Terminology that you may hear whe

2018-11-19 11:47Writer: qyadminReading:

  1.Solder jumper - a small, blob of solder connecting two adjacent pins on a component on a circuit board. Depending on the design, a solder jumper can be used to connect two pads or pins together. It can also cause unwanted shorts.

  2.Surface mount - construction method which allows components to be simply set on a board, not requiring that leads pass through holes in the board. This is the dominant method of assembly in use today, and allows boards to be populated quickly and easily.

  3.Thermal - a small trace used to connect a pad to a plane. If a pad is not thermally relieved, it becomes difficult to get the pad to a high enough temperature to create a good solder joint. An improperly thermally relieved pad will feel “sticky” when you attempt to solder to it, and will take an abnormally long time to reflow.

  4.Thieving - hatching, gridlines, or dots of copper left in areas of a board where no plane or traces exist. Reduces difficulty of etching because less time in the bath is required to remove unneeded copper.

  5.Trace - a continuous path of copper on a circuit board.

  6.V-score- a partial cut through a board, allowing the board to be easily snapped along a line.

  7.Via - a hole in a board used to pass a signal from one layer to another. Tented vias are covered by soldermask to protect them from being soldered to. Vias where connectors and components are to be attached are often untented (uncovered) so that they can be easily soldered.

  8.Wave solder - a method of soldering used on boards with through-hole components where the board is passed over a standing wave of molten solder, which adheres to exposed pads and component leads.

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