The Sumary of the double side PCB technology

2018-11-23 18:01Writer: qyadminReading:

 Sumary:

  • Drilling

  • Activation Sn → Pd - electroless Cu – galvanic Cu – panel-plating ~5 µm

  • Solid photoresist lamiation – Photolithography – negative mask

  • Galvanic Cu → 20µm

  • Galvanic Sn (~10µm)

  • Stripping

  • Selectiv etching

  • Removing Sn layer

  • Soldermask

  •Surface finishing (Au, Ag, Sn, OSP)

           
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