Trend of PCB material: clean and high performance.
2018-11-23 21:20Writer: qyadminReading:
PCB (Printed circuit board) material classification.
The printed circuit board produces a wide variety of materials, which can be divided into two categories: main materials and auxiliary materials.
Main material: the raw materials that become part of the product, such as copper foil laminate, resistance flux ink, marking ink, etc. Also called materialized materials. Auxiliary materials: materials used in the process of production, such as anti-erosion dry film, etching solution, electroplating solution, chemical cleaning agent, drilling entry and backup board, etc., also known as non-materialized materials.
As electronic devices tends to miniaturization, lightweight, more functional and environmental protection direction, the PCB material should also correspondingly in the direction of development, adapt to the needs of these aspects.
Environment-friendly products are the need of sustainable development. Environment-friendly PCB requires environment-friendly materials. The PBB and PBDE are prohibited by the European Union RoHS directive for the use of PBB and PBDE, which involves the removal of brominated flame retardants. At present, the international advanced countries have begun to use of halogen free copper-clad plate, and no halogen copper-clad plate products only in the domestic large enterprises of foreign successful development, many small and medium-sized plate copper-clad enterprises is still in the traditional manufacturing copper-clad plate, failed to meet the requirements for environmental protection ban.
Environmental protection products should not be toxic, but also require that the products can be recycled and reused. So PCB base material insulating resin layer considering change from thermosetting resin for thermoplastic resin, so convenient for recycling waste printed circuit board, after heating, make resin separation with copper foil or metal parts, each can be reused. It has been successfully applied in the report of the high density interconnection printing plate in the product layer, and there is no movement in the country.
The most traditional application is tin-lead alloy solder. Now the eu RoHS directive prohibits lead. The replacement is tin, silver or nickel/gold plating. Abroad of electroplating chemicals has been in previous years the company has research and development, the launch of electroless nickel/immersion gold, electroless plating, electroless plating tin silver drugs, but did not see the same type of domestic suppliers have similar new materials.
Cleaner production materials
Cleaner production is an important means to realize sustainable development of environmental protection. Traditional printing plate production method is copper foil etching to form a graphic subtractive method, which USES chemical corrosion solution, and also produces a lot of waste water. Abroad has been in development and application of copper foil type catalytic laminate material, formed by direct chemical sink copper line graphic addition process technology, saves the chemical etching, and reduce waste water, is advantageous to the cleaner production. This kind of laminated sheet material used in addition process is still blank in China.
It is a kind of dry production process, which is cleaner without chemical and water cleaning. The key of this technology is the inkjet printing press and the conductive paste material, and now the foreign development of the nano-level conductive paste material, so that the inkjet printing technology into the practical application. This is the revolutionary change of printing plate towards cleaner production. There is still a shortage of micron-grade conductive paste materials that meet the cross-line and perforated holes of the printing plate in China, and the nano-level conductive paste materials are much less visible.
In the clean production, it is also expected that the cyanide-free electroplating process material, not harmful formaldehyde to be used as reducing agent chemical precipitation copper process materials, it is necessary to accelerate development and apply to the printing plate production.
High performance material
The electronic equipment to the digital development, the matching printing plate performance also has higher requirements. At present, there are low dielectric constant, low moisture absorption, high temperature resistance, high dimensional stability and so on. The key to meet these requirements is to use high performance copper foil laminate materials. Also, in order to realize the printing plate thin and light, high density, need to use thin fiber cloth, thin copper foil copper foil laminate material.
The key to highlight the light, thin and soft characteristics of flexible printing plate is flexible copper clad laminate material, and many digital electronic devices need to apply high performance flexible copper foil laminate materials. At present, the direction of improving the performance of flexible copper foil laminate is non-adhesive flexible coated copper foil.
The IC seal loading plate has been a branch of the printed board, and is now widely used in the new IC packaging represented by BGA and CSP. The IC seal loading board USES thin organic substrate materials with high frequency performance, heat resistance and high dimensional stability. High performance materials have been applied in foreign countries and have been further improved and new materials have been produced. In contrast, domestic counterparts are still blank in many high performance materials.
In order to make China a major power and power in the printed circuit industry, there is an urgent need for the materials of printed boards made in China.