About Detailed Procedures of Plating Copper for PCB Processi

2018-11-23 18:05Writer: qyadminReading:
 
  Summary: Technical Analysis of Plating Copper for PCB Processing

                                                                                                                     ——Technical Analysis of Plating Copper for PCB Processing

  Electroless plating is widely used in the printed circuit board (PCB) production and processing which has holes on that and it can also be called PTH(Plate Through Hole), the main purpose is to deposit a layer of copper through a series of chemical treatment methods in the conductive substrate, and then increasing the thickness of the copper layer through subsequent electroplating methods to its specific thickness of design which is usually 1 mil (25.4 um) or more thicker, and sometimes even directly increasing the thickness of copper of the whole printed circuit board by using the special chemical methods.
     

    The meanings of PTH include at least one or both two of the following:

  1. Become part of circuits between components and conductors

  2. Become interconnected circuits or printed circuits among layers

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