msap pcb application
With regards to smartphone designs, every millimeter of space cost savings achieved. within these devices enclosure can unlock significant value for the finish customer. It creates possible the use of bigger, higher-resolution shows, bigger batteries. and more advanced processors and components. All this enhances the device’s feature arranged. and improves the entire user experience.
These form-factor-driven design stresses have relieved partly . via the increased use of high-density interconnects (HDIs). which allow more functions per device area than standard printed circuit planks (PCBs). Leveraging finer lines, slimmer materials, and laser-drilled vias. HDIs have performed an essential role in the ongoing miniaturization of smartphones. and their inlayed subsystems.
But once we evolve from 4G LTE to next-generation, 5G-compatible smartphones. the PCB industry’s method of HDI manufacturing must evolve. Massive-MIMO (multiple-input multiple-oOutput) antenna configurations. and complicated RF front-ends will expand the RF content footprint. within the 5G smartphone. and the digesting power. had a need to support the staggering level of 5G data. will impact electric battery capacities and geometries. among a great many other factors. Because of this, despite increased I/O needs. the quantity of available space for HDI PCBs within 5G smartphones will reduced.
Moreover, the bigger frequencies inherent to 5G will demand much stricter impedance control. If not created with extreme precision, the slimmer traces of HDIs can expose. increased threat of transmission degradation and data-integrity lapses.
Addition and Subtraction
PCB manufacturers can overcome these difficulties. through the use of a modified semi-additive process (mSAP). Popular today in IC substrate creation. mSAP poised for common adoption in the advanced HDI PCB production industry.
Current collection/space requirements have. before reduced to 30/30 and anticipated to decrease even more to 25/25. or even 20/20. mSAP is completely in a position to support these requirements. allowing 5G smartphone makers to do unprecedented device densities. while leveraging superior conductor geometries for exacting impedance control at high-frequency procedure.
mSAP is actually the opposite-or invert image, if you will-of conventional subtractive procedures. Inside a subtractive process, fine lines shaped. by coating the copper coating with an etch resist. applying photolithography to image the areas where in fact the copper should maintained. and etching away the un-imaged materials.
The primary drawback of the approach would be that the chemical treatment used to etch the lines. will also dissolve the copper in a horizontal path along the trace walls. Within a cross-section view, the producing traces can look trapezoidal in form. This wedged-shaped track can bring in myriad impedance anomalies. and bargain circuit density in situations where lines produced wider than meant.
But, with mSAP, a much thinner copper layer covered onto the laminate. and plated in the areas where in fact the resist isn’t applied-thus, the “additive” nature of the procedure. The slim copper leftover in the areas between conductors is then etched away. Whereas track geometries described during subtractive procedures, mSAP allows track geometries to described. via photolithography. The traces are thus created with much higher precision, in vertical lines. yielding a rectangular-shaped cross-section that maximizes circuit density. and allows accurate impedance control with lower transmission loss.
The rectangular form enabled by the mSAP process is a lot more effective. maximizing circuit density and accurate impedance control with lower signal loss.
Advanced Production Techniques
mSAP can help PCB manufacturers overcome the specialized hurdles of. advanced HDI creation for 5G smartphones. but mSAP must implemented in a fashion that minimizes costs. and maximizes creation throughput. and produce to ensure enough profits on return. Whereas IC substrate creation can absorb the bigger costs associated with mSAP. the commercial-volume level of smartphone PCB production. is much less forgiving where costs and creation efficiencies worried.
To use mSAP in mass creation, PCB suppliers are buying the advanced production tools. and techniques essential to maintain and extend their competitive benefit. through the changeover from 4G LTE to 5G smartphones. With this situation. HDIs with higher densities and exactly formed lines is a critical need.
These PCB manufacturers are adopting advanced direct-imaging (DI) systems. with the capacity of attaining 10-micron lines . and 15-micron line spacing. with high registration accuracy right down to 7.5 microns. to ensure precise uniformity. These features can encompass advanced localized-registration features. made to allow the registration of partitions within the average person PCB.
DI systems equipped with high depth of concentrate (DoF). and multi-wavelength light resources. can produce sharper advantage patterns across a multitude of resists. while maintaining high throughput, high quality and constant uniformity.
Leveraging advanced automated-optical-inspection (AOI) systems. PCB manufacturers can and identify HDI defects for improved quality assurance. and decrease the false alarms that may stall production procedures. Furthermore, 2D metrology evaluation capabilities. may employed to enable constant automatic inline dimension of top. and bottom level conductor widths, ensuring accurate. and repeatable dimension using streamlined sampling techniques. and allowing improved impedance control.
Where appropriate, PCB manufacturers could also use automated-optical-shaping (AOS) systems to remove defects. such as opens, nicks, and shorts. Using 3D-shaping features that recreate the initial design. AOS systems can employed to internal. and external HDI layers. Whereas manual repair is less accurate. and can damage the panel, AOS allows exact, high-quality shaping, improving yield. while removing PCB scrap. thus developing a competitive cost framework for the finish client.
these advanced HDI manufacturing solutions. should tied with each other with a software framework. that collects data throughout the production process, identifying when, where. and what sort of PCB handled at every touchpoint. This assists to ensure end-to-end HDI traceability for events. where QA troubleshooting may needed. while providing a alternative view into production workflows.
The evolution of 5G smartphones needs a new method of advanced HDI production. that maximizes the density of onboard embedded electronics. while reducing RF signal friction at high frequencies. mSAP is which makes it easy for PCB suppliers to meet these exacting requirements. while leveraging DI, AOI, and AOS systems to help lower production costs. speed up creation throughput, and increase yield.
SAP VS mSAP
SAP is Semi-Additive Processing and mSAP stands for Modified Semi-Additive Processing.
SAP and mSAP are not new terms to the electronics industry. they are common processes in IC substrate fabrication. but these are processes that are emerging technology in the PCB fabrication segment. Let’s explore more in depth. These acronyms are getting a lot of attention lately. and are new acronyms for the PCB industry, which is infamous for using them.
After saying this is new technology for PCB fabrication. I am reminded that most of our smartphones contain circuit boards. that use this technology. But outside of the high-volume, smartphone market. the rest of us are starting to learn about. and install this technology for flexible circuits, rigid flex. and rigid PCB applications.
Subtractive etch process: This is the traditional flexible circuit fabrication technique. Starting with laminate consisting of polyimide and copper. ¼ ounce or greater, the circuit pattern formed by patterning. and etching away the unwanted copper.
SAP: Semi Additive Process. This process utilizes additive process steps, adding copper to the base dielectric. rather than subtractive processes to create the circuit pattern.
mSAP: Modified Semi Additive Process. This process also utilizes additive process steps rather than subtractive processes. to create the circuit pattern.
Subtractive etch processing is the predominant PCB fabrication method. This technology limited to feature sizes of 3 mil line and space and greater. A few companies with advanced capabilities can offer line and space down to 2 mil. but this specialized technology with leading edge equipment. Today’s sophisticated electronics are pushing the limits of. this technology with a need for finer line. and space.
Additive processing, but, is predominant in IC substrate fabrication . and emerging in the PCB fabrication environment. Additive processing allows line width and space at 5 um and below. IC fabrication limited to much smaller panel sizes than we see in PCB fabrication. As this process evolves. and adapted to the PCB fabrication environment. this has the potential to bridge the gap in both feature size and panel size.
Both follow the same basic manufacturing process. the primary difference is in the seed layer of copper. SAP processes begin with a thin seed layer of electroless copper, less than 1.5 um. and mSAP processes begin with a thin laminated copper foil, greater than 1.5 um of copper. First, a thin layer of copper coated on the substrate and followed by a negative pattern design. Copper is then electroplated to the desired thickness. and the seed copper layer removed.
As an example, one method of fabricating with a semi-additive process. utilizes an ALD precursor ink. which controls the horizontal dimensions of the line width and space. while the vertical thickness controlled by an additive process. that deposits metal only on the pattern defined by the precursor ink.
Drill vias in the substrate using either mechanical or laser drills.
Prep the substrate for processing. This is a simple cleaning step. and mounting in the appropriate material handling system.
Coat and cure the substrate with a precursor catalytic ink. resulting in a subnano layer (<1nm thick) of catalytic material.
Deposit electroless copper on the precursor. The copper thickness ranges from .1 um to 1 um.
Image a layer of photoresist using photolithographic techniques. to create the pattern that copper will deposited. The geometry of lines and spaces that can produced at this point is anything greater than 5 um.
Electrolytic copper plating completes the circuit pattern. followed by stripping the rest of the resist. and flash etching the seed layer of copper.
How is msap pcb work
With 5G technology around the corner, we are looking at the emergence of 5G smartphones. While this requires new manufacturing technologies. such as high-density interconnect Printed Circuit Boards (HDI PCB). smartphones need to be less expensive and produced at greater efficiencies.
Customers usually covet compact sleek devices. Thus, manufacturers need to balance function. and form so that their products stand out in a crowd in a competitive marketplace. The smartphone market can be a treacherous place with corporate fortunes rising. and falling on the success and failures of specific generations of phones.
Smartphone designers tend to use every millimeter of space within the device enclosure. to unlock significant value for the user. This is how they are able to fit in large. and high-resolution displays, large batteries, and more sophisticated processors. This allows designers offer more functionality with an enhanced feature set. improving the user experience.
As most of the design of a smartphone is form-factor driven. PCBs in the form of high density interconnects are the major contributors. These HDI PCBs designed circuits differing from conventional PCBs. as they provide the designer with more functions per unit area. Their main advantage is finer copper traces, thinner and more flexible base material. and laser drilled via holes. Although HDI PCBs have played a crucial role in creating miniature smartphones. and other embedded subsystems, 5G technology demands are more severe.
The new generation smartphones compatible to 5G requires complex RF front ends. and antenna configurations involving many inputs and many outputs. generally known as massive-MIMO. This not only expands the footprint of the RF content within the phone. but also enhances the processing power necessary to. control the staggering volume of 5G data. all the extra features and functionality affects the battery capacity. and hence, the geometry of the phone. if the phone geometry is not to increase , the 5G smartphone will have much less space for the HDI PCB inside.
With the reduction in internal space for the PCB. and use of higher 5G frequencies. designers will need to exercise much stricter control on the impedance of traces. Unless they design with extreme precision. the thin traces in HDI PCBs can increase the risk of signal degradation. resulting in lapses of data integrity.
PCB designers and fabricators are overcoming these challenges by following the mSAP process. Fabricators of IC substrates generally use this semi-additive process. and HDI PCB fabricators have adopted its modified version.
Typical line to space ratios on the HDI PCBs are 30:30, meaning designers plan for a spacing of 30 µm. between adjacent traces of 30 µm width each. Demands of increasing density are forcing fabricators towards line-space ratios of 25:25. and even 20:20, with the help of mSAP. This enables makers of 5G smartphones. and other demanding gadgets to achieve unprecedented densities. while offering superior geometries with exacting impedance control for their high frequency operation.
Contrary to the subtractive processes used for normal PCB etching. mSAP does the reverse, coating a thin copper trace onto the laminate. and building up its thickness by electroplating over it.
Other PCB work
SP: SP is the earliest traditional process. is also the manufacturing process of mature application. using light to complete the pattern transfer and the corrosion resistance of materials. material to protect the area without etching, followed by acidic. or alkaline etching liquid copper layer will not protect regional removal.
In the subtractive process, the biggest disadvantage lies in the etching process. the bare copper layer in the process of etching down to side etching (i.e. side etching). the lateral erosion exists. reducing application in fine line production in the process is very limited. when the line width / spacing less than 50 m (2mil) when because the yield is too low, minus has been useless. At present, the subtractive method used for the production of ordinary PCB, FPC. HDI and other printed circuit board products.
SAP: full additive process using an insulating substrate containing photosensitive catalyst. in line graph. after exposure by selective chemical deposition of copper conductor pattern. The additive process is more suitable for the production of fine lines. but because of its substrate, electroless copper has special requirements. different from the traditional PCB manufacturing process. high cost and technology is not mature, production is not present. The method can used for production of WB or FC chip on board, the process can reach 12 mu m/12 mu m.
MSAP: MSAP based on how to overcome the respective reduction method. and the additive in fine line manufacturing problem. Semi additive for electroless copper on the substrate. and the resist pattern formed thereon. after plating on the substrate to remove the resist pattern thickening pattern. and then remove the excess chemical copper layer after flash etching. dry film protection no electroplate area in the differential etching process is very. fast the removal of the remaining part of the formation of the line.
MSAP characterized by the formation of graphics by electroplating and flash erosion. In the process of flash etching, the etching time is very short because of the very thin copper layer.
Compared with the reduction method. the line width is not affected by copper plating thickness, easy to control. with higher resolution, the production of fine line width and line distance is. almost the same. improve the rate of finished products. Semi additive method is the main method for the production of fine lines. production capacity can reach the minimum line width / spacing of 14 m/14 m. the minimum aperture of 55 m, manufacturing is widely used in CSP, WB. and FC flip chip substrate and fine circuit board.
The carrier plate belongs to the class of printed circuit board, but in the process. the minimum line width / spacing is 30 mu m/30 mu m, not by subtractive production. also need to use the MSAP process technology
printed circuit. choose num. circuit board. pcb prototype. pcb manufacturing. pcb fabrication. pcb assembly. 24 hours. solder mask. circuits provides. prototype pcb. quick turn. customer service. pcb fab. low cost. instant quote. united states. board pcb. flying probe. board thickness. surface finish. electrical testing. green solder. mask white. white silkscreen. advanced pcb. pcb quote. assembly service. 10 layers. pcb layout. standard pcb. 40 layers. manufacturing process. multilayer pcb. part number. ic programming. 0.5 oz. soft gold. immersion silver. turn time. copper weight. ontime shipping.