The Flex-Rigid PCB Designer's Factors on Impedance Design

2019-11-20 16:42Writer: qyadminReading:

  Concern#1: Reference plane should be grid reference plane and copper foil reference plane.


  Predicated on the experimental results in the above list, it could be concluded that architectural design predicated on copper foil reference plane is with the capacity of conference the impedance dependence on flex-rigid PCB. When grid reference plane was created, the bigger grid is, the bigger difference it'll generate between grid impedance for the minimal residual rate of copper and copper foil impedance as the smaller grid is, small difference it'll generate between grid impedance for the utmost residual rate of copper and copper foil impedance.

  To conclude, grid design as reference plane is carefully related to grid size, that is, residual rate of copper. The bigger residual rate of copper is, small difference will be between it and copper foil impedance and theoretical design data. The low residual rate of copper is, the bigger difference will be between it and copper foil impedance and theoretical design data. Because of this, when grid is chosen as reference plane, copper should be covered on reference plane appropriate for corresponding impedance collection position.


   Concern#2: Flex-rigid PCB impedance should be designed depending on adding features of impedance computation software.


  Weighed against ordinary impedance computation software, impedance computation software with adding efficiency contains gain access to acquisition function for every medium coating and performs more accurately in conditions of gain access to acquisition. Furthermore, it's simpler to simulate useful situations and far more convenient to be employed for executive design.

     Concern#3: Dielectric continuous of each solitary layer is obtained on flex-rigid table.


  It could be verified predicated on full-scale tests that dielectric continuous of PI is 2.8 while that of adhesive is 3.5, which may be used as a reference for flex-rigid panel developer. Theoretical data computation based on the use of impedance computation software with adding features is with the capacity of conference the demand of flex-rigid PCB customers.(http://www.ysbackupboard.com)


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